Hitag S 2048 Card
FEATURES
Integrated Circuit for Contactless Identification Transponders and Cards
Integrated resonance capacitor of 210 pF with +/- 5 % tolerance over full production.
Frequency range 100..150 kHz.
Protocol
Modulation Read/Write Device ® Transponder: 100 % ASK and Binary Pulse Length Coding
Modulation Transponder ® Read/Write Device: Strong ASK modulation with Anticollision, Manchester and
Biphase Coding
Data integrity check (CRC)
Optional Transponder Talks First Modes with user defined data length
Temporary switch from Transponder Talks First into Reader Talks First Mode
Data Rate Read/Write Device to Transponder: 5.2 kBit/s
Data Rates Transponder to Read/Write Device: 2 kBit/s, 4 kBit/s, 8 kBit/s
Memory
Memory option:2048 Bit
More than 100 000 erase/write cycles
10 years non – volatile data retention
Secure Memory Lock functionality
Supported Standards
ISO 11784⁄85, ISO 14223⁄1 compliant
Compliant to German Waste Management Standard (BDE)
Compliant to German Pigeon Race Standard
Security Features
32 Bit Unique Identification Number (UID)
48 Bit secret key based encrypted authentication
Delivery Types
Sawn, gold – bumped 8 inch Wafer
Contactless Chip Card Module MOA2
I – Connect (Low Cost Flip Chip Package)
| Product Features | HITAG™ S 2048 |
| Total Memory | |
| Size [bit] | 2048 |
| Write Endurance [cycles] | 100 000 |
| Data Retention [yrs] | 10 |
| Organisation | 64 blocks á 4 bytes |
| RF-Interface | |
| According to | HITAG 1+,ISO11784/ISO11785 |
| Frequency | 100 … 150 kHz |
| Baudrate [kbit/s] | up to 8 |
| Anticollision | yes, collision detection |
| Operating Distance [m] | up to 2.0 |
| Security | |
| Unique Serial Number [byte] | 4 |
| Write Protection | blockwise, multi user mode |
| Access Keys | 48-bit |
| Access Conditions | Encrypted Mutual Authentication or Plain |
| Encryption Algorithm | yes, for authentication only |
| Special Features | |
| EAS | - |
| AFI | - |
| EPC | - |
| TTF Modes | yes |
| Destroy Command | - |
| Privacy Command | - |
| Packaging | |
| Sawn Wafer | - |
| Sawn Wafer (Au-Bumped) | HTSICHxx01EW/V4 |
| Other Packages | FCP2, HVSON2, MOA2 |
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| NXP Smart Label and Tag Ics | ||||
| ISO 15693 | ISO 18000 | ISO 11784⁄85 | ||
| Product Features | HITAG™ μ | HITAG™ μ Advanced | HITAG™ μ Advanced+ | HITAG™ RO64 |
| Total Memory | ||||
| Size [bit] | 128 | 512 | 1760 | 64 |
| Write Endurance [cycles] | 100 000 | 100 000 | 100 000 | 100 000 |
| Data Retention [yrs] | 10 | 10 | 10 | 10 |
| Organisation | 4 blocks á 4 bytes | 16 blocks á 4 bytes | 55 blocks á 4 bytes | 2 blocks á 4 bytes |
| RF-Interface | ||||
| According to | ISO11784/85 | ISO11784/85 | ISO11784/85 | ISO11784/85 |
| Frequency | 100 … 150 kHz | 100 … 150 kHz | 100 … 150 kHz | 100 … 150 kHz |
| Baudrate [kbit/s] | up to 8 | up to 8 | up to 8 | up to 8 |
| Anticollision | - | yes, collision detection |
yes, collision detection |
- |
| Operating Distance [m] | up to 2.0 | up to 2.0 | up to 2.0 | up to 2.0 |
| Security | ||||
| Unique Serial Number [byte] | 4 | 4 | 4 | 4 |
| Write Protection | blockwise | blockwise | blockwise | - |
| Access Keys | 32-bit | 32-bit | 32-bit | - |
| Access Conditions | Plain, Password | Plain, Password | Plain, Password | - |
| Encryption Algorithm | - | - | - | - |
| Special Features | ||||
| EAS | - | - | - | - |
| AFI | - | - | - | - |
| EPC | - | - | - | - |
| TTF Modes | yes | yes | yes | yes |
| Destroy Command | - | - | - | - |
| Privacy Command | - | - | - | - |
| Packaging | ||||
| Sawn Wafer | - | - | - | - |
| Sawn Wafer (Au-Bumped) | HTMS1001FUG/AM 1) HTMS8001FUG/AM |
HTMS1x01FUG/AM HTMS8x01FUG/AM |
HTMS1x01FUG/AM HTMS8x01FUG/AM |
HTCIC6402FUG/AM HTCIC6403FUG/AM |
| Other Packages | FCP2, HVSON2, SOT-1122 |
FCP2, HVSON2, SOT-1122 |
FCP2, HVSON2, SOT-1122 |
FCP2, HVSON2, SOT-1122 |